Pretech SBC RK3576: High-Performance Single Board Computer
Pretech SBC RK3576: High-Performance Single Board Computer
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Pretech SBC RK3576: High-Performance Single Board Computer

Model: H3576
The Pretech SBC RK3576 features an RK3576 processor with 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, based on 8nm process technology. It offers various display interfaces like MIPI, EDP, LVDS, Display Port, and HDMI-out. It also supports 1000M Ethernet, WIFI6, Bluetooth5.2, Mini-PCIE for 4G, USB3.0, USB2.0, Mic SD Card Slot, Dclass amplifier, 3.5mm headphone jack, MIC input, Key button interfaces, Speaker and mic interfaces, UART, Mipi-Camera interface, TP-COF interface, NFC module interface, RTC battery, LED or GPIO expansion interface, BAT-IN-12V and DC-IN-12V interfaces. The power input is AC100-240V.50-60HZ, with a DC12V/5.5mm DC head output of 2A-5A.
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Pretech SBC RK3576: High-Performance Single Board Computer

Pretech SBC RK3576 ODM Industry Applications

The Pretech SBC RK3576 is widely used in various ODM industry applications. In smart home, it serves as the core control board for devices like smart cameras and displays. In industrial automation, it acts as the control core for robots and production lines. In education, it is used to develop educational robots and interactive devices. In medical care, it is used in imaging equipment and telemedicine systems. It is also applicable in transportation, finance, and security fields, providing support for intelligent applications.
Pretech SBC RK3576 ODM Industry Applications

PRODUCT DETAIL

RK3576-H3576
  • RK3576, 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, 8nm<br> GPU ARM Mali-G52 MC3<br> OpenGL ES3.2/OpenCL 2.0/Vulkan1.1<br> 6.0TOPS NPU, INT4,INT8,INT16, float16, Bfloat 16 and tf32 operation<br> Supports deep learning framework：TensorFlow, Caffe, Tflite, Pytorch, Onnx NN，Android NN, etc.
    SOC
    RK3576, 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, 8nm
    GPU ARM Mali-G52 MC3
    OpenGL ES3.2/OpenCL 2.0/Vulkan1.1
    6.0TOPS NPU, INT4,INT8,INT16, float16, Bfloat 16 and tf32 operation
    Supports deep learning framework：TensorFlow, Caffe, Tflite, Pytorch, Onnx NN，Android NN, etc.
  • Connectivity
    Connectivity
    WIFI6 802.11a/b/g/n/ac/ax，Bluetooth5.2
    Support Mini-PCIE 4G data communication module
  • 1 x Key interface (PWR/VOL+/VOL-/RST) <br> 2 x Speaker interface, 1x mic interface <br> 2 x UART, PH2.0-4Pin <br> 1 x Mipi-Camera interface, FPC-0.5mm-30pin <br> 1 x TP-C0F interface, FPC-0.5mm-10pin <br> 1 x NFC module interface, FPC-0.5mm-10pin <br> 1 x RTC battery, support timer on/off <br> 1 x LED or GPI0 expansion interface, PH2.0-6Pin <br> 1 x BAT-IN-12V interface, PH2.0-6Pin <br> 1 x DC-IN-12V interface, PH2.0-4Pin
    Interface
    1 x Key interface (PWR/VOL+/VOL-/RST)
    2 x Speaker interface, 1x mic interface
    2 x UART, PH2.0-4Pin
    1 x Mipi-Camera interface, FPC-0.5mm-30pin
    1 x TP-C0F interface, FPC-0.5mm-10pin
    1 x NFC module interface, FPC-0.5mm-10pin
    1 x RTC battery, support timer on/off
    1 x LED or GPI0 expansion interface, PH2.0-6Pin
    1 x BAT-IN-12V interface, PH2.0-6Pin
    1 x DC-IN-12V interface, PH2.0-4Pin

What We Do

We offer ODM solutions for certain customers who have specific needs which can’t be satisfied by existing devices on the market.
  • Tooling
    ID Design
    MD Design
  • Software
    Drive Debugging
    System Customization
    Debug Pre-installed applications
  • Hardware
    Schematic Diagrams Design
    PCB Layout
    Specific components design
    Bill of Materials output
    Gerber Files
    RF Design and Verification
    Assembly Drawings
    Test Specifications output
  • Accessories
    Smart Cover
    Docking Charging Station
    Charging Bracket/Dock
    Magnetic BackClip
    Wall Mount
    Stylus Pen
    And more

How We Do

We offer ODM solutions for certain customers who have specific needs which can’t be satisfied by existing devices on the market.
  • 01 Planning
    Market Survey
    Requirements Collection
    Competitiveness Analysis
    Technology Study
    Risk Analysis
    Component Life Cycle Survey
    Cost Evaluation
  • 02 Desgin
    ID Design
    MD Design
    Hardware
    OS
  • 03 Validation
    Trial Samples
    Software Customization
    Performance Tests
    Reliability Tests
    EVT
    DVT
    Certifications
  • 04 Integration
    Assembly Study and SOP
    Pilot Run Production
    Testing Process Study and SOP
    Field Test/Feedbacks
    Improvements
  • 05 Production
    Pilot Run Production
    Mass Production
  • 06 After Service
    Global Warranty
    Extended Warranty Service
    Online Service

Specification

  • OS
    Android
  • SOC
    RK3576, 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, 8nm
    GPU ARM Mali-G52 MC3
    OpenGL ES3.2/OpenCL 2.0/Vulkan1.1
    6.0TOPS NPU, INT4,INT8,INT16, float16, Bfloat 16 and tf32 operation
    Supports deep learning framework：TensorFlow, Caffe, Tflite, Pytorch, Onnx NN，Android NN, etc.
  • RAM
    LPDDR4 4G/8G
  • ROM
    EMMC5.1 32G/64G/128G
  • Media
    Decode:
    4K@60fps H.264/AVC
    8K@30fps or 4K@120fps H.265/HEVC/VP9/AVS2/AV1
    1080@60fps H264/MVC

    Encoded:
    Dual video encoders which support H.265 and H.264
    H.264 and H.265 up to 4K@60fps
    Supports multi-stream encoding
  • Display
    mipi interface (2560x1600@60fps)
    EDP screen interface (1920*1080@60fps)
    LVDS screen interface (1920x1080@60fps)
    DisplayPort(4K@120fps) A1tMode on Type-C
    HDMI-0UT(8K@60fps(4K@ 120fps), or EDP-4K screen interface (3840*2160@60fps)
  • Ethernet
    1000M Ethernet(supports PoE with add-on PoE HAT)
  • Connectivity
    WIFI6 802.11a/b/g/n/ac/ax，Bluetooth5.2
    Support Mini-PCIE 4G data communication module
  • USB
    TYPE-C USB (OTG) x 1
    TYPE-A USB3.0 x 1
    USB2.0 docks x 3
  • Micro SD Card
    Mic SD Card Slot x1
  • Audio
    Dclass oversized built-in speaker amplifier, supports 10W x 24R
    3.5mm headphone holder
    MIC input, 2Pin-PH2.0
  • Interface
    1 x Key interface (PWR/VOL+/VOL-/RST)
    2 x Speaker interface, 1x mic interface
    2 x UART, PH2.0-4Pin
    1 x Mipi-Camera interface, FPC-0.5mm-30pin
    1 x TP-C0F interface, FPC-0.5mm-10pin
    1 x NFC module interface, FPC-0.5mm-10pin
    1 x RTC battery, support timer on/off
    1 x LED or GPI0 expansion interface, PH2.0-6Pin
    1 x BAT-IN-12V interface, PH2.0-6Pin
    1 x DC-IN-12V interface, PH2.0-4Pin
  • Input Power
    Input: AC100-240V.50-60HZ,
    Output: DC12V/5.5mm DC head 2A-5A (surge voltage less than 18V, ripple voltage less than 100mV)
  • PCB
    Size: 81.5x130x1.6mm
    Process: 6-layer-through-hole-sinking-gold one-piece board
    Hole: ∮3.5mmx4
  • Environment
    Operating temperature -20°C ~ 70°C

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