Home >> Solution >> SOM

PRODUCT DETAIL

SOM58S
project-left
project-left
  • LPDDR4 4G/8G/16G
    SOC
    LPDDR4 4G/8G/16G
  • Integrated PCle3.0/GMAC/SDI03.0/USB3.0, <br>Expandable multi-channel dry megabit Ethernet<br>WiFi6/Bluetooth, <br>5G/4G LTE
    Connectivity
    Integrated PCle3.0/GMAC/SDI03.0/USB3.0,
    Expandable multi-channel dry megabit Ethernet
    WiFi6/Bluetooth,
    5G/4G LTE
  • High-Speed Interfaces:<br>USB OTG 3.1/2.0/Typec<br>2x USB Host 2.0<br>SATA3/PCle2.1<br>SATA3/PCle2.1/USB3Host<br><br>Other Interfaces:<br>9 x 12C/10 x UART/5 x SPI/7 x ADC/16 x PWM/1 X SDMMC/GPIO
    Interface
    High-Speed Interfaces:
    USB OTG 3.1/2.0/Typec
    2x USB Host 2.0
    SATA3/PCle2.1
    SATA3/PCle2.1/USB3Host

    Other Interfaces:
    9 x 12C/10 x UART/5 x SPI/7 x ADC/16 x PWM/1 X SDMMC/GPIO
  • SPECIFICATION

OS Android/Linux
SOC RK3588S, 4 x Cortex-A76 + 4 x Cortex-A55 2.4GHz, 8nm
GPU ARM Mali-G610 MP4 Quad-Core
OpenGL ES3.2/OpenCL 2.2/Vulkan1.1,450 GFLOPS
6.0TOPS NPU, Support INT4/INT8/INT16
RAM LPDDR4 4G/8G/16G
ROM EMMC5.1 64G/128G/256G
Media Decode:
8K 60fps H.265NP9/AVS2
8K 30fps H.264AVC/MVC
4K 60fps AV1
1080P 60fps MPEG-2/-1/C-1P8
Encoded:
8K 30fps encoding,
Support H.265/H.264 Up to 32-channel
1080P 30fps decoding and 16-channel
1080P 30fps encoding
Display 1 x HDMI2.1 (8K@60fps or 4K@120fps, HDMI multiplexed with eDP)
2 x MIPL-DSL (4K@60fos)
1 x xDP1.4 (8K@30fps, multiplexed with USB3.0)

1 x MIPICSl (4 Lanel or 2xMIPI CS2 Lane)
1 x DVP camera interface (up to 150MH input data)
Supports multiple 8K video outputs and 4K video inputs, Up to 3 screens with different displays
Ethernet 1000M Ethernet (The carrier board)
Connectivity Integrated PCle3.0/GMAC/SDI03.0/USB3.0,
Expandable multi-channel dry megabit Ethernet
WiFi6/Bluetooth,
5G/4G LTE
USB USB OTG 3.1/2.0/Type C
2 x USB Host 2.0
Micro SD Card Micro SD card,up to 130GB(The carrier board)
Audio Can be customized
Interface High-Speed Interfaces:
USB OTG 3.1/2.0/Typec
2x USB Host 2.0
SATA3/PCle2.1
SATA3/PCle2.1/USB3Host

Other Interfaces:
9 x 12C/10 x UART/5 x SPI/7 x ADC/16 x PWM/1 X SDMMC/GPIO
Input Power The carrier board can be customized
PCB Size: 50 x 60 x 1.2mm
Process :8-layers HDI-2 lmmersion Gold
Package:LCC+LGA(246Pin,1.0mm)
Environment Operating temperature -20°C ~ 60°C
  • Inquriy

Interested in
learning more
ODM solutions?
See all of our smart devices solution for every industry