RK3588S SOM: Empowering Next-Gen Smart Applications

RK3588S, 4 x Cortex-A76 + 4 x Cortex-A55 2.4GHz, 8nm
GPU ARM Mali-G610 MP4 Quad-Core
OpenGL ES3.2/OpenCL 2.2/Vulkan1.1,450 GFLOPS
6.0TOPS NPU, Support INT4/INT8/INT16

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SOM58S

RK3588S, 4 x Cortex-A76 + 4 x Cortex-A55 2.4GHz, 8nm
GPU ARM Mali-G610 MP4 Quad-Core
OpenGL ES3.2/OpenCL 2.2/Vulkan1.1,450 GFLOPS
6.0TOPS NPU, Support INT4/INT8/INT16

PRODUCT DETAIL

SOM58S

SOC

LPDDR4 4G/8G/16G
Connectivity

Integrated PCle3.0/GMAC/SDI03.0/USB3.0,
Expandable multi-channel dry megabit Ethernet
WiFi6/Bluetooth,
5G/4G LTE
Interface

High-Speed Interfaces:
USB OTG 3.1/2.0/Typec
2x USB Host 2.0
SATA3/PCle2.1
SATA3/PCle2.1/USB3Host

Other Interfaces:
9 x 12C/10 x UART/5 x SPI/7 x ADC/16 x PWM/1 X SDMMC/GPIO

Specification

OS

Android/Linux
SOC

RK3588S, 4 x Cortex-A76 + 4 x Cortex-A55 2.4GHz, 8nm
GPU ARM Mali-G610 MP4 Quad-Core
OpenGL ES3.2/OpenCL 2.2/Vulkan1.1,450 GFLOPS
6.0TOPS NPU, Support INT4/INT8/INT16
RAM

LPDDR4 4G/8G/16G
ROM

EMMC5.1 64G/128G/256G
Media

Decode:
8K 60fps H.265NP9/AVS2
8K 30fps H.264AVC/MVC
4K 60fps AV1
1080P 60fps MPEG-2/-1/C-1P8
Encoded:
8K 30fps encoding,
Support H.265/H.264 Up to 32-channel
1080P 30fps decoding and 16-channel
1080P 30fps encoding
Display

1 x HDMI2.1 (8K@60fps or 4K@120fps, HDMI multiplexed with eDP)
2 x MIPL-DSL (4K@60fos)
1 x xDP1.4 (8K@30fps, multiplexed with USB3.0)

1 x MIPICSl (4 Lanel or 2xMIPI CS2 Lane)
1 x DVP camera interface (up to 150MH input data)
Supports multiple 8K video outputs and 4K video inputs, Up to 3 screens with different displays
Ethernet

1000M Ethernet (The carrier board）
Connectivity

Integrated PCle3.0/GMAC/SDI03.0/USB3.0,
Expandable multi-channel dry megabit Ethernet
WiFi6/Bluetooth,
5G/4G LTE
USB

USB OTG 3.1/2.0/Type C
2 x USB Host 2.0
Micro SD Card

Micro SD card,up to 130GB（The carrier board）
Audio

Can be customized
Interface

High-Speed Interfaces:
USB OTG 3.1/2.0/Typec
2x USB Host 2.0
SATA3/PCle2.1
SATA3/PCle2.1/USB3Host

Other Interfaces:
9 x 12C/10 x UART/5 x SPI/7 x ADC/16 x PWM/1 X SDMMC/GPIO
Input Power

The carrier board can be customized
PCB

Size: 50 x 60 x 1.2mm
Process :8-layers HDI-2 lmmersion Gold
Package:LCC+LGA(246Pin，1.0mm)
Environment

Operating temperature -20°C ~ 60°C

Inquriy

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