The main structure and manufacturing process of POE (Power over Ethernet) panels typically depend on the specific product type and manufacturer. However, the following are the general main structure and key points of the manufacturing process:

Main Structure:

Enclosure: The enclosure is typically made from durable materials such as metal or engineering plastics to protect internal electronic components. The design of the enclosure often depends on the product's intended use, including considerations for water resistance, dust resistance, or explosion-proof features.

Display Screen: POE panels typically feature a display screen for showing information, user interfaces, or monitoring content. These displays can be LCD screens, touchscreens, LED displays, or other types, depending on the product design and purpose.

Power and Circuit Board: These components include power management circuits, processors, memory, network interfaces, and more, used for power supply, control, and device connectivity. The critical components of POE technology are usually located on the circuit board.

Ports and Interfaces: POE panels typically feature various ports and interfaces to support different connectivity needs. This may include RJ45 Ethernet ports, USB interfaces, RS485 interfaces, HDMI ports, etc., depending on the product's functionality and purpose.

Wall Mounting Hardware: For wall-mounted POE panels, they often come with brackets, screws, and other fixtures for easy installation on walls or other surfaces.

Key Manufacturing Process Points:

Circuit Design and Layout: Designing the circuits for POE panels is a critical manufacturing process step. This involves selecting appropriate components, laying out the circuit board, connecting the circuits, and designing power management, among other considerations, to ensure stable power supply and good performance.

Mechanical Design: Mechanical design includes designing the enclosure to meet the product's intended use and external environmental conditions. This involves determining the enclosure's size, shape, sealing performance, and more.

Component Selection and Assembly: Selecting the right electronic components, such as processors, memory, display screens, and others, and assembling them is a key part of manufacturing POE panels. Soldering, connections, and component assembly are critical steps in this process.

Enclosure Manufacturing and Assembly: Manufacturing the enclosure typically involves materials forming, mold-making, and assembling the enclosure. The enclosure needs to be robust and protective.

Testing and Quality Control: POE panels must undergo various tests during the production process to ensure their performance and quality. This may include power testing, network connectivity testing, durability testing, and more.

Software Development and Debugging: For POE panels with software control features, application and firmware development, testing, and debugging are essential aspects of manufacturing.

In conclusion, manufacturing POE panels involves multiple manufacturing process steps, including circuit design, mechanical design, component selection, assembly, testing, and quality control. The specific details and requirements of these steps may vary depending on the product type and manufacturer.

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