Pretech SOM RK3576: High - Performance System on Module for Diverse Applications
Pretech SOM RK3576: High - Performance System on Module for Diverse Applications
Home >> Solutions >> SOM

Pretech SOM RK3576: High - Performance System on Module for Diverse Applications

Model: SOM3576-F
The Pretech SOM RK3576 is a powerful module with an 8nm RK3576 chip. It has an octa-core CPU (4 x Cortex-A72 + 4 x Cortex-A53 at 2.3GHz) and a Mali-G52 MC3 GPU supporting OpenGL ES3.2, OpenCL 2.0 and Vulkan 1.1. The 6.0TOPS NPU handles INT4, INT8, INT16, float16, Bfloat16 and tf32 operations, and supports TensorFlow, Caffe, Tflite, Pytorch, Onnx NN and Android NN. Memory options include LPDDR4 (4G/6G/8G) and LPDDR5 (4G/6G/8G/12G/16G). Display interfaces are HDMI2.1/eDP1.3 combo, MIPI-DSI-2, DisplayPort 1.4/USB3.2 combo, E-ink EPD and parallel RGB888, supporting up to 4K@120Hz and 2560x1920. It has a 16M pixel ISP with HDR (up to 120dB), MIPI CSI-2 and DVP camera interfaces. Connectivity includes 1000M Ethernet, WIFI6, Bluetooth5.2, USB3.1 OTG, USB3.0 and USB2.0. I/O interfaces are UART, I2C, SPI, PCM, PWM, ADC, SDMMC and GPIO, with CAN FD x 2. The carrier board is customizable. It operates within -20°C to 60°C.
Inquiry Ask for A Demo
Pretech SOM RK3576: High - Performance System on Module for Diverse Applications

Pretech SOM RK3576 ODM Industry Applications

The Pretech SOM RK3576 is versatile for various industries. In smart homes, it powers intelligent control hubs with high - resolution displays. In industrial automation, it serves as edge computing devices for local data processing and quality inspection systems. For automotive, it integrates into ADAS and in - vehicle infotainment systems. In medical, it assists in medical imaging and diagnostic equipment. It is also suitable for IoT smart sensors and gateways. The RK3576S can be customized for specific ODM projects.
Pretech SOM RK3576 ODM Industry Applications

PRODUCT DETAIL

SOM3576-F
  • RK3576, 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, 8nm<br> GPU ARM Mali-G52 MC3<br> OpenGL ES3.2/OpenCL 2.0/Vulkan1.1<br><br> 6.0TOPS NPU, INT4,INT8,INT16, float16, Bfloat 16 and tf32 operation<br> Supports deep learning framework：TensorFlow, Caffe, Tflite, Pytorch, Onnx NN，Android NN, etc.
    SOC
    RK3576, 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, 8nm
    GPU ARM Mali-G52 MC3
    OpenGL ES3.2/OpenCL 2.0/Vulkan1.1

    6.0TOPS NPU, INT4,INT8,INT16, float16, Bfloat 16 and tf32 operation
    Supports deep learning framework：TensorFlow, Caffe, Tflite, Pytorch, Onnx NN，Android NN, etc.
  • Connectivity
    Connectivity
    WIFI6 802.11a/b/g/n/ac/ax，Bluetooth5.2（The carrier board）
  • USB 3.2 Gen1 supports type-C AltMode with DP<br> PCIe 2.1/SATA 3.0/USB 3.0 combo port<br> PCIe 2.1/SATA 3.0 combo port<br> UART/I2C/SPI/PCM/PWM/ADC/SDMMC/GPIO<br> CAN FD x 2
    Interface
    USB 3.2 Gen1 supports type-C AltMode with DP
    PCIe 2.1/SATA 3.0/USB 3.0 combo port
    PCIe 2.1/SATA 3.0 combo port
    UART/I2C/SPI/PCM/PWM/ADC/SDMMC/GPIO
    CAN FD x 2

What We Do

We offer ODM solutions for certain customers who have specific needs which can’t be satisfied by existing devices on the market.
  • Tooling
    ID Design
    MD Design
  • Software
    Drive Debugging
    System Customization
    Debug Pre-installed applications
  • Hardware
    Schematic Diagrams Design
    PCB Layout
    Specific components design
    Bill of Materials output
    Gerber Files
    RF Design and Verification
    Assembly Drawings
    Test Specifications output
  • Accessories
    Smart Cover
    Docking Charging Station
    Charging Bracket/Dock
    Magnetic BackClip
    Wall Mount
    Stylus Pen
    And more

How We Do

We offer ODM solutions for certain customers who have specific needs which can’t be satisfied by existing devices on the market.
  • 01 Planning
    Market Survey
    Requirements Collection
    Competitiveness Analysis
    Technology Study
    Risk Analysis
    Component Life Cycle Survey
    Cost Evaluation
  • 02 Desgin
    ID Design
    MD Design
    Hardware
    OS
  • 03 Validation
    Trial Samples
    Software Customization
    Performance Tests
    Reliability Tests
    EVT
    DVT
    Certifications
  • 04 Integration
    Assembly Study and SOP
    Pilot Run Production
    Testing Process Study and SOP
    Field Test/Feedbacks
    Improvements
  • 05 Production
    Pilot Run Production
    Mass Production
  • 06 After Service
    Global Warranty
    Extended Warranty Service
    Online Service

Specification

  • OS
    Android
  • SOC
    RK3576, 4 x Cortex-A72 + 4 x Cortex-A53 2.3GHz, 8nm
    GPU ARM Mali-G52 MC3
    OpenGL ES3.2/OpenCL 2.0/Vulkan1.1
    6.0TOPS NPU, INT4,INT8,INT16, float16, Bfloat 16 and tf32 operation
    Supports deep learning framework：TensorFlow, Caffe, Tflite, Pytorch, Onnx NN，Android NN, etc.
  • RAM
    LPDDR4 4G/6G/8G
    LPDDR5 4G/6G/8G/12G/16G
  • ROM
    EMMC5.1 64G/128G
  • Media
    H.265 HEVC Main10 L5.1 yuv444: 4K 120fps
    H.264 AVC High10 L5.1 yuv422: 4K 60fps
    H.264 MVC up to 1080P 60fps
    VP9 Profile0/2 L5.1: 4K 120fps
    AVS2 Profile0/2 L10.2.6: 4K 120fps
    AV1 Main10 L5.3: 4K 120fps
    4K@60fps video encoders for H.264/H.265
  • Display
    1 x HDMI2.1/eDP1.3 Combo TX, up to 4K@120Hz
    1 x 4-Lane MIPI-DSI-2 TX with C/D-PHY,up to 2560x1600@60hz
    1 x DisplayPort 1.4@ 4K60/USB3.2 gen1x1 Combo TX
    1 x E-ink EPD (Electronic Paper Display) TX @ 2560x1920
    1 x Parallel interface (RGB888) TX @ 1080P60
    1 x MIPI CSI-2 with D-PHY (4x1, 2x2)
    1 x MIPI CSI-2 with C/D-PHY (4x1)
    1 x DVP 8/10/12/16-bit
    16M Pixel ISP with HDR (up to 120dB)
  • Ethernet
    1000M Ethernet x 2（The carrier board）
  • Connectivity
    WIFI6 802.11a/b/g/n/ac/ax，Bluetooth5.2（The carrier board）
  • USB
    USB3.1 OTG x 1
    USB 3.0 x 1
    USB2.0 x n (The carrier board）
  • Micro SD Card
    Micro SD card,up to 128GB（The carrier board）
  • Audio
    Can be customized
  • Interface
    1 x USB 3.2 Gen1 supports type-C AltMode with DP
    1 x PCIe 2.1/SATA 3.0/USB 3.0 combo port
    1 x PCIe 2.1/SATA 3.0 combo port
    1 x UART/I2C/SPI/PCM/PWM/ADC/SDMMC/GPIO
    2 x CAN FD
  • Input Power
    The carrier board can be customized
  • PCB
    Size: 50 x 69.6 x 1.2mm
    Process: 6-layer HDI Immersion Gold
    Package:PC DDR4 connector
  • Environment
    Operating temperature -20°C ~ 60°C

Inquriy

See all of pretech smart devices solution for every industry See all of pretech smart devices solution for every industry
Interested in learning more?
See all of our smart devices solution for every industry
Learn more Contact us
© Pretech International Co., Limited All rights Reserved